Dummy-Bauteile
| |  Typ |
Beschreibung | Datum |
|
BGA & CSP und NEU: WLP-CSP mit besonders geringer Bauteilhöhe
|
WLP-CSP, CSP, µBGA, SBGA, PBGA, CBGA, eBGA, CCGA (Column Grid Array), CLGA, LGA
Pitch: 0,3 mm - 0,4 mm - 0,5 mm - 0,65 mm - 0,75 mm - 0,8 mm - 1,0 mm - 1,27 mm - 1,5 mm
6....10.000 Balls | 2011 |
|
Black & White Ceramic Chips For Calibration
|
Exakt gefräste Keramik-Chips für präzises Vermessen der Platziergenauigkeit von Bestückautomaten und zum Verifizieren der Meßgenauigkeit von AOI-Systemen.
Erhältlich in Größen 0201 bis 1206 und in den Farben Schwarz oder Weiß. | 2011 |
|
CLCC & CERQUAD
|
Ceramic Quad Flat Pack,
Pitch: 0,38 mm....1,27 mm
28....352 Leads | 2011 |
|
|
DPAK Power Device
|
DPAK Power Device
DPAK (6mm x 6,5mm x 2,3mm)
D2PAK (9,2mm x 10mm x 4,4mm)
D3PAK (14mm x 16mm x 4,7mm) | 2011 |
|
Flat Pack
|
Pitch: 1,27 mm und neu 0,635 mm,
10....56 Leads | 2011 |
|
Flip-Chip
|
Pitch: 152 µm, 204 µm, 254 µm, 457 µm | 2011 |
|
LCC
|
Leadless Chip Carrier,
Pitch: 1,27mm,
20....84 Leads | 2011 |
|
LQFP
|
Low Profile Quad Flat Pack,
Dicke: 1,4 mm,
Pitch: 0,4....0,8 mm,
32....256 Leads | 2011 |
|
M-QFN
|
Open Cavity Leadless QFN, SLP, DFN,
Pitch: 0,4 mm....0,65 mm,
8....80 Leads | 2011 |
|
MSOP
|
Miniature Small Outline Package,
Pitch: 0,5 oder 0,65 mm,
8 oder 10 Leads | 2011 |
|
PLCC
|
Plastic Leaded Chip Carrier (J-Lead)
Pitch: 1,27 mm
18....84 Leads | 2011 |
|
QFP
|
Quad Flat Pack,
Dicke: 2,0....3,8 mm,
Pitch: 0,4....1,0 mm,
44....304 Leads | 2011 |
|
|
Rechteckige Dioden
|
Rectangular Diodes
0,8mm x 0,6mm x 0,4mm bis
7,0mm x 6,0mm x 2,3mm | 2011 |
|
|
SC
|
Ceramic Chip Capacitor
01005, 0201, 0402, 0603, 0805, 1206, 1210, 1812, 2225, 2512
| 2011 |
|
|
SD
|
Tantalum Capacitor Molded Case
3216, 3528, 6032, 7343, 1608, 2012 | 2011 |
|
|
SE
|
Aluminium Capacitor
Durchmesser: 3mm....20mm,
Höhe: 5,5....22mm
| 2011 |
|
SO
|
Small Outline Gull Wing,
Pitch: 1,27mm,
8....44 Leads;
neu: Tape & Reel mit 7'' (180mm) und 13'' (330mm)
| 2011 |
|
SOJ, SOLJ
|
Small Outline J-Lead,
Pitch: 1,27 mm,
20....44 Leads;
neu: Tape & Reel mit 7'' (180mm) und 13'' (330mm)
| 2011 |
|
|
SOT Transistor
|
SOT Small Outline Transistor
3....8 leads
1,2mm x 0,8mm x 0,5mm
bis 6,5mm x 3,6mm x 1,6mm
| 2011 |
|
SR
|
Resistor Chip
01005, 0201, 0402, 0603, 0805, 1206, 1210, 2010, 2512
| 2011 |
|
|
SRM
|
MELF & Mini-MELF Diodes
| 2011 |
|
|
SS
|
Gold Solderable Chips Fully Conductive
0201, 0402, 0603, 0805, 1206 | 2011 |
|
SSOP & QSOP
|
Shrink Small Outline Package,
Pitch: 0,4....1,27 mm,
8....80 Leads | 2011 |
|
TQFP
|
Thin Quad Flat Pack,
Dicke: 1,0 mm,
Pitch: 0,4....0,8 mm,
32....176 Leads | 2011 |
|
TSOP
|
Thin Small Outline Package,
Pitch: 0,5....1,27 mm,
28....86 Leads | 2011 |
|
|
TSSOP
|
Thin Shrink Small Outline Package,
Pitch: 0,4....0,45 mm,
8....80 Leads | 2011 |
|
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