Dummy-Bauteile
| |  Typ |
Beschreibung | Datum |
|
BGA & CSP
|
CSP, µBGA, SBGA, PBGA, CBGA, eBGA, CCGA (Column Grid Array), CLGA, LGA
Pitch: 0,4 mm - 0,5 mm - 0,8 mm - 1,0 mm - 1,27 mm - 1,5 mm
6....10.000 Balls | 2010 |
|
Black & White Ceramic Chips For Calibration
|
Exakt gefräste Keramik-Chips für präzises Vermessen der Platziergenauigkeit von Bestückautomaten und zum Verifizieren der Meßgenauigkeit von AOI-Systemen.
Erhältlich in Größen 0201 bis 1206 und in den Farben Schwarz oder Weiß | 2010 |
|
BQFP
|
Bumpered Quad Flat Pack, Pitch 0,636 mm, 100 oder 132 Leads | 2010 |
|
CLCC
|
Ceramic Quad Flat Pack, Pitch: 1,27 mm, 28....84 Leads | 2010 |
|
Flat Pack
|
Pitch: 1,27 mm und neu 0,635 mm, 10....56 Leads | 2010 |
|
Flip-Chip
|
Pitch: 152 µm, 204 µm, 254 µm, 457 µm | 2010 |
|
LCC
|
Leadless Chip Carrier, Pitch: 1,27mm, 20....84 Leads | 2010 |
|
LQFP
|
Low Profile Quad Flat Pack, Dicke: 1,4 mm, Pitch: 0,4....0,8 mm, 32....256 Leads | 2010 |
|
MSOP
|
Miniature Small Outline Package, Pitch: 0,5 oder 0,65 mm, 8 oder 10 Leads | 2010 |
|
PLCC
|
Plastic Leaded Chip Carrier (J-Lead)
Pitch: 1,27 mm
18....84 Leads | 2010 |
|
QFN
|
Leadless QFN, SLP, DFN, Pitch: 0,5 mm & 0,65 mm, 6....80 Leads | 2010 |
|
QFP
|
Quad Flat Pack, Dicke: 2,0....3,8 mm, Pitch: 0,5....1,0 mm, 44....304 Leads | 2010 |
|
SO
|
Small Outline Gull Wing, Pitch: 1,27mm, 8....44 Leads; neu: Tape & Reel mit 7'' (180mm) und 13'' (330mm)
| 2010 |
|
SOJ, SOLJ
|
Small Outline J-Lead, Pitch: 1,27 mm, 20....44 Leads; neu: Tape & Reel mit 7'' (180mm) und 13'' (330mm)
| 2010 |
|
SR
|
Resistor Chip
01005, 0201, 0402, 0603, 0805, 1206, 1210, 2512
| 2010 |
|
SSOP & QSOP
|
Shrink Small Outline Package, Pitch: 0,4....1,27 mm, 8....80 Leads | 2010 |
|
TQFP
|
Thin Quad Flat Pack, Dicke: 1,0 mm, Pitch: 0,4....0,8 mm, 32....176 Leads | 2010 |
|
TSSOP
|
Thin Small Outline Package, Pitch: 0,5....1,27 mm, 28....86 Leads | 2010 |
|
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_Mehr in Kürze...
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